Author: Kulyk Viktoria
Supervisor: Uvarov Borys
Speciality: 172 Telecommunications and Radio Engineering
Summary: Actuality of theme. Computer components have the ability to heat up and, as a result, fail and break. In 85% of cases, the fact is that the user does not know how to find out the temperature of the processor, video card and other components of the computer.
The aim of the study. Improvement of the methods of study of temperature regimes of SCM to ensure the reliability of the REA.
In order to achieve this goal, the following research objectives were formulated, which determined the logic of the research and its structure. Investigate temperature regimes in SCM using special software. Development of the hardware for connecting the DP to the computer and a virtual device for measuring the temperature on the DP.
The object of the study is the temperature of the electric print structure on SCM.
The subject of research is the methods of determining the temperature in SCM
Research Methods: LabVIEW Designed in the Software Environment. Method of study of temperature regimes on printed circuit boards using TermoAss2015 and TempPlat2015 programs.
Scientific novelty of the obtained results. The hardware part for the ability to connect the printed circuit board to the computer is simulated. A virtual device for temperature processing was developed and comparable results with studies conducted with the help of special software.
The practical value of the results obtained is to develop a virtual device for easy measurement of temperature on printed circuit boards.
The work consists of: 95 pages of explanatory note and 1 appendix
Explanatory note: Full text